Beyond lead-free solders, Lichuang also sells BGA solder ball, solder tip thinner, tin dross reduction powder and solder wire tube.
1.BGA Solder Ball
The BGA (ball grid array package) solder ball, or lead-free solder ball is used to replace the pin in IC component package structure, meeting the demand of electrical interconnection and mechanical connection. The solder balls are usually applied to digital cameras, MP3/4, laptops, mobile phones, LED, home theatre, etc.
2.Solder Tip Thinner
After years of research and investigation, Lichuang launches solder tip tinner or cleaner which is good at renewing the oxidized tip. It produces little smoke and pungent smell.
3.Tin Dross Reduction Powder
The tin dross reduction power is a sort of while powder substance made up from inorganic reductant and some organic reductant. And it does not contain hazardous heavy metal elements, such as lead, cadmium, chromium and mercury.
4.Solder Wire Tube
Lichuang soldering wire tube features little smoke, little pungent odor, few residues and high insulation resistance. It is bright and clear from dust.
Lichuang (Taishan) Electronic Technology Co., Ltd
Address : Changlong Industrial Zone, Sijiu Town, Taizhou City
E-mail : email@example.com
Tel : +86-750-5482656
Lead-free solders generally available manufacturing method of the casting, i.e., said heavy metal raw materials, and heated and stirred in air melt in a crucible or pot. Solder alloy prepared by the method of the invention, its advantages First, reduce the melting point of the solder alloy, generally less than 200 ℃; Second, the solid-liquid phase difference between the alloy up the following 2 ℃, avoid isolated spot defects; Third alloy homogeneous, the alloy strength increases; Fourth spreading rate of the solder alloy can