Home Products Others BGA Solder Ball
Detailed Product Description

Introduction

The BGA (ball grid array package) solder ball, or lead-free solder ball is used to replace the pin in IC component package structure, meeting the demand of electrical interconnection and mechanical connection. Generally, the ball diameter varies from 0.1 mm to 1.8 mm. Due to different alloy composition, the eutectic temperature is different. The highest temperature is 217 ℃ while the lowest is 183℃. The solder balls are usually applied to digital cameras, MP3/4, laptops, mobile phones, LED, home theatre, etc.


Features

1. Lichuang BGA solder ball is characterized by high reliability, favorable mechanical performance, preferable fatigue resistance and admirable anti-oxidation.

2. Both the purity and the roundness are quite high and have no defects.

3. The minimum ball diameter is 0.10mm. And Lichuang can customize balls of non-standard diameters based on client’s requirement.

4. This BGA solder ball also possesses autocorrection function and allows relatively large tolerance.

5. The lead-free solder ball meets the standard of ROHS and REACH, suitable for advance packing technology and fine welding.

Parameters of BGA Solder Ball

Composition of Alloy

Eutectic Temperature

(℃)

Ball Diameter

( mm)

Application

Sn63/Pb37

183

0.1-1.8

Digital Camera, MP3/4, Laptop, Mobile communication device (mobile phone,  high frequency communication device), LED, LCD, DVD, Computer Main board, Car LCD TV, home theatre, GPS.

Sn100

232

0.1-1.8

Sn96.5/Ag3.5

221

0.1-1.8

Sn96.5/Ag3/Cu0.5

217

0.1-1.8

Sn95.5/Ag4/Cu0.5

217

0.1-1.8

Solder Ball Size and Packaging

Ball Diameter (mm)

Tolerance (mm)

Roundness (mm)

Packing Specification (ten thousand/bottle)

0.10

± 0.010

< 0.008

50/100

0.20

± 0.010

< 0.008

50/100

0.25

± 0.010

< 0.008

50/100

0.30

± 0.010

< 0.010

25/50/100

0.35

± 0.010

< 0.010

25/50/100

0.40

± 0.015

< 0.013

25/50

0.45

± 0.015

< 0.013

25/50

0.50

± 0.015

< 0.013

25

0.55

± 0.015

< 0.015

25

0.60

± 0.020

< 0.018

25

0.65

± 0.020

< 0.018

25

0.76

± 0.020

< 0.020

25

1.50

± 0.050

< 0.040

0.5kg

Use

1. Take out the needed number of BGA solder balls.

2. Put the used lead-free solder ball into a container.

3.  Before reusing the balls, make sure again they can work reliably.

4.  Do not shake or vibrate the balls vigorously during use.

5. When placing the balls, the soldering flux and solder paste should not be too much or too little.

Storage

1. BGA solder ball should be stored under conditions that the temperature is 25 ±10℃ and the relative humidity is below 60% RH. And it can be stored for as long as twelve months.

2. It had better be working under the same environment as that of the storage.

3. The storage spot is expected to prevent the balls from shake, moisture and direct sunlight. Otherwise, the balls quality will decrease.

4. It is suggested to store the temporarily unused balls in the original bottle and tighten the internal and external covers. Try not to open the bottle when balls are not needed, avoiding solder ball oxidation.

 

Tag:
Contact Details

Lichuang (Taishan) Electronic Technology Co., Ltd

Address : Changlong Industrial Zone, Sijiu Town, Taizhou City

E-mail : li-chuang@china-hanxi.com

Tel : +86-750-5482656

Other Products