Detailed Product Description

Features

1. This medium-high temp Pb free Sn-Ag-Cu solder features high purity, excellent solder ability, good wettability, strong anti-oxidization, little solder residue, little solder spatter, little smoke and smell, fast soldering speed, great thermal fatigue resistance and good fluidity.

2. We manufacture the tin silver copper alloy for medium-high temperature according to RoHS and REACH standards.

3. Solder flux is uniformly distributed in Pb free Sn-Ag-Cu solders.

4. Solder joints rarely craze and shows great reliability as well as superior mechanical performance; besides, copper corrosion is weak.

5. This tin silver copper alloy for medium-high temperature needs no cleaning.

6. It has high insulation resistance.

7. Pb free Sn-Ag-Cu solders are widely utilized in soldering temp-sensitive components, LEDs and many other electronic elements.

Types
Sn96.5Ag3Cu0.5 Solder
Sn95.5Ag4Cu0.5 Solder
Sn95.8Ag3.5Cu0.7 Solder
Sn95.5Ag3.8Cu0.7 Solder

Parameters of Pb Free Sn-Ag-Cu Solder

Alloy Composition

Melting Point (℃)

Proportion

Application

Solidus

Liquidus

Sn-3.0Ag-0.5Cu

217

219

7.40

Hand Soldering and Wave Soldering

Sn-4.0Ag-0.5Cu

217

219

7.40

Sn-3.5Ag-0.7Cu

217

217

7.40

Sn-3.8Ag-0.7Cu

217

217

7.40

 

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Contact Details

Lichuang (Taishan) Electronic Technology Co., Ltd

Address : Changlong Industrial Zone, Sijiu Town, Taizhou City

E-mail : li-chuang@china-hanxi.com

Tel : +86-750-5482656

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