Sn-Ag lead free solder is developed as an alternative of lead solders. Generally, commercial tin/silver alloy contains 3% to 5% silver. The Sn/Ag series solders are widely used in soldering electronic assemblies; besides, it is applicable for soldering of jewelry due to its solder point is of high brightness. Unlike the conventional lead solders, they can be utilized in pipe joints which have contact with water and foodstuffs. Sn-Ag lead free solder is featured with high melting point and strong thermal strength. As professional tin silver alloy solder maker, we provide various Sn-Ag solders. The typical product is Sn95Ag5 tin silver solder wires and bars.
Lichuang (Taishan) Electronic Technology Co., Ltd
Address : Changlong Industrial Zone, Sijiu Town, Taizhou City
E-mail : firstname.lastname@example.org
Tel : +86-750-5482656
Solder ball is widely used in modern microelectronics, IC manufacturing process is a function of notebook computers, mobile communication devices, computer motherboards, light emitting diodes, liquid crystal displays, PDA, digital photos and other products with the essential craft materials, particularly play a crucial role in the process of LSI miniature.
Welding solder is usually not lower than the melting temperature of the solidus of the base material, its chemical composition, mechanical, and thermal properties are relatively close to the base material, such as a variety of welding, flux-cored welding of electronic components, such as widely used in the computer , radios, televisions, appliances, instruments, etc.
Aluminum brazing flux is suitable for welding aluminum to aluminum copper and aluminum. It has a moderate flowability, and the advantages of good bonding strength of the anti-aging properties. And equipped with a non-corrosive, stable performance, long-term preservation. More importantly, the particular specifications of the aluminum flux can be customized. All in all, it is ideal for copper - aluminum and aluminum-copper welding.
Solder widely properties, high tensile strength, excellent fatigue resistance, special heat conductivity, corrosion resistance strong, powerful antioxidant. Solidus and liquidus is221 ℃. High strength, good oxidation resistance, excellent resistance to thermal fatigue and creep resistance, low melting point, good fluidity characteristics, making it the best solder optoelectronic package.
A low temperature solder of bismuth, indium, cadmium in the formation of solder in the solder alloy, mainly for microelectronic sensor assembly of parts with low heat resistance, good wettability and solderability, solder full, uniform welding excellent results, without requiring high temperatures and pressures may be used to seal solder metal welding.