Sn Ag Solder

Detailed Product Description

Introduction

Medium-high Sn-Ag solder is fusible metal alloy with a melting range from90 °Cto450°C. Soldering is the process in which two or more metal items are jointed together by melting and leading a filler metal into the joint. Tin silver lead free alloy is widely for connection or repairing electronic equipments in computers, radios, instruments, meters, house appliances, etc.

Features

1. Medium-high Sn-Ag solder is in higher price than some other solders, but it is still popular among customers because it is featured with favorable wettability and good thermal fatigue resistance.

2. It features good fluidity, high soldering speed, little solder splatter, little smoke and smell, weak copper corrosion, etc.

3. Because of strong anti-oxidization, the medium-high Sn-Ag solder produces little residue.

4. Solder flux is well and uniformly distributed.

5. Solder joints rarely crack.

Working Principle

Soldering is distinguished from brazing by use of a lower melting-temperature filler metal; it is distinguished from welding by the base metals not being melted during the joining process. In a soldering process, heat is applied to the parts to be joined, causing the solder to melt and be drawn into the joint by capillary action and to bond to the materials to be joined by wetting action. After the metal cools, the resulting joints are not as strong as the base metal, but have adequate strength, electrical conductivity, and water-tightness for many uses.

Types of Medium-High Sn-Ag Solders

Sn97Ag3 Solder (Bar, Wire) 
Sn96.3Ag3.7 Solder (Bar, Wire) 
Sn96.5Ag3.5 Solder (Bar, Wire)

Parameters of Medium-High Sn-Ag Solders

Alloy Composition

Melting Point (℃)

Proportion

Application

Solidus

Liquidus

Sn-3Ag

221

222

7.40

Hand Soldering/Wave Soldering

Sn-3.7Ag

221

221

7.40

Sn-3.5Ag

221

221

7.40

 

 Solder Flux for Medium-High Sn-Ag Solder

Code

Item

 

LC--T-1

 

LC--H-1

 

LC--P-1

 

LC--HF01

 

LC--WS01

Flux Content (%)

2.2 ± 1.0

2.5 ± 0.5

2.2 ± 1.0

3.0 ± 0.5

2.5 ± 0.5

Halide Content (%)

0.05--0.1

<0.05

<0.05

0

0.1--0.2

Fluorine Content (%)

 

NONE

NONE

NONE

NONE

NONE

Silver Chromate Test

PASS

PASS

PASS

PASS

PASS

Copper Mirror Test

PASS

PASS

PASS

PASS

PASS

Copper Plate Corrosion Test

 

PASS

 

PASS

 

PASS

 

PASS

 

PASS

SIR

>1 ×1011

>1 × 1010

>1 × 1011

>1 × 1011

>1 ×1011

(After Cleaning)

Electro Migration

PASS

PASS

PASS

PASS

PASS

(After Cleaning)

Characteristic

It belongs to halogen-free solder and enjoys wide range of applications.

It is used in soldering nickeling elements and lamp holders.

It is used to solder zinc electrode for capacitors.

It contains little halogen.

Its residue is washable.

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Contact Details

Lichuang (Taishan) Electronic Technology Co., Ltd

Address : Changlong Industrial Zone, Sijiu Town, Taizhou City

E-mail : li-chuang@china-hanxi.com

Tel : +86-750-5482656

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