|
Introduction
This Sn-Ag-Bi-Cu solder alloy (Sn96Ag2.5Bi1Cu0.5) bar is a rosin-cored and lead-free product. It is applicable for soldering high-precision electronic products and heat-sensitive components, including LEDs, radios, instruments, meters, thermal overload protectors, etc.
Features
1. The (Sn96Ag2.5Bi1Cu0.5) Sn-Ag-Bi-Cu solder alloy bar features low melting point which is about 213 degrees Celsius.
2. With no-clean activated rosin flux inside, the tin silver bismuth copper alloy solder bars/wires show superior soldering performance.
3. Sn-Ag-Bi-Cu solder alloy bar presents high melting speed, favorable wetting property, distinguished electrical conductivity and extraordinary fluidity.
Element Composition
Element |
Sn |
Bi |
Pb |
Al |
Sb |
As |
Cu |
Fe |
Zn |
Cd |
Ag |
Ni |
In |
Proportion / % |
The Rest |
0.8-1.2 |
0.10 |
0.001 |
0.10 |
0.03 |
0.3-0.7 |
0.02 |
0.001 |
0.002 |
2.3-2.7 |
0.01 |
0.10 |
Physical Parameters of Sn-Ag-Bi-Cu Solder Alloy Bars (Sn96Ag2.5Bi1Cu0.5)
Alloy Composition |
Melting Point (℃) |
Specific Gravity |
Application |
|
Solidus |
Liquidus |
|||
Sn-2.5Ag-1Bi-0.5Cu |
213 |
218 |
7.40 |
Hand Soldering and Wave Soldering |
Lantytk Solder Material
Address : No 5558 Chuansha Road, Pudong Discrict, Shanghai, China
E-mail : landy.sh137@gmail.com
Tel : +86-21-60346873