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Introduction
Sn-Cu lead-free solder bars are commonly used in soldering metal equipments, copper tubes, copper plates, and so on. Adopting lead-free technology, it is environmentally friendly. Besides, our Sn99.3Cu0.7 solder enjoys finer grain structure and shinier surface than the conventional ones. As eutectic alloy, Sn-Cu solder rod has the melting point of227°C.
Features
1. Diameter of this Sn-Cu lead-free solder bar is more than0.2 mm.
2. It possesses a relatively low melting point.
3. High anti-oxidization makes only a little tin slag come into being.
4. Compared with conventional Sn99Cu1 alloys, this Sn99.3Cu0.7 solder shows advantages of low metal dissolution rate.
5. Optimum working temperatures ranges from260°Cto270°C.
6. Sn-Cu lead-free solder bar features good mechanical properties, strong thermal fatigue resistance, good fluidity, superior wetting characteristics and excellent soldering performance.
Parameters of Sn-Cu Solder Rod
Series |
Model |
Representative Composition |
Characteristics |
Applicable Process |
Sn-Cu |
LC-01-01 |
Sn-0.7Cu |
It features low melting point ,low using temperature, strong anti-oxidation property, good solder ability and thermal fatigue resistance. The surface of solder joints is bright and glazed, it is mainly used for manual soldering and wave soldering. |
Manual Soldering, Wave Soldering |
LC-01-02 |
Sn-1.5Cu |
It is featured with low melting point, high using temperature, high anti-oxidation. It is mainly used for the disposable soldering for the stripping of enamelled wires. |
Manual Soldering |
|
LC-01-03 |
Sn-3.0Cu |
Lantytk Solder Material
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