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Introduction
Unlike other Sn-Cu-Ag Pb free alloy solders, the Sn95Cu4Ag1 solder wire/bar is specially utilized in precise soldering work for computer chips, mobile phone chips, stainless steel products, LED, PCBs, and so on. Meanwhile, it is suitable for restoration of mini-sized electronic equipments.
Features
1. Active rosin flux in this Sn-Cu-Ag Pb free alloy solder ranges from 1.5% to 2.5%.
2. Wire diameter is0.8 mm. Each reel of solder wire is0.5 kg.
3. It is specially used in PCB and SMD repairing work.
4. Sn95Cu4Ag1 solder wire/bar features good solder ability, strong fatigue resistance and anti-oxidization. .
5. Soldering joint by this Sn-Cu-Ag Pb free alloy solder can produce high resistivity.
6. The three kinds of metal elements are combined in this alloy such as to endows the solder with a high melting point.
7. Solder joints are bright and glossy.
Physical Properties of Sn-Cu-Ag Pb Free Alloy Solders (Sn95Cu4Ag1)
Alloy Component |
Melting Point (℃) |
Tensile Strength (g/cm3) |
Rigidity (HB) |
Heat Conductivity (M.S.K) |
Tensile Strength (MPa) |
Elongation Rate (%) |
Electric Conductivity, (%) |
Sn95Cu4Ag1 |
230 |
7.4 |
9 |
64 |
32 |
48 |
16.0 |
Lantytk Solder Material
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