Sn96.5Ag3Cu0.5 Solder Wire and Solder Bar

Welding solder is usually not lower than the melting temperature of the solidus of the base material, its chemical composition, mechanical, and thermal properties are relatively close to the base material, such as a variety of welding, flux-cored welding of electronic components, such as widely used in the computer , radios, televisions, appliances, instruments, etc.

A low temperature solder of bismuth, indium, cadmium in the formation of solder in the solder alloy, mainly for microelectronic sensor assembly of parts with low heat resistance, good wettability and solderability, solder full, uniform welding excellent results, without requiring high temperatures and pressures may be used to seal solder metal welding.

This heat gun is widely used in advertising cloth, tarpaulin, water-proof film, impermeable liner, water-proof membrane, pipe, electronic components, car bumper, sports floor, electroplating tank, plastic pipe, PP/PE/PVC and other sheet. The hot air gun is also suitable for membrane structure welding, geomembrane local welding and repair.

Solder is a general term applied to fill the weld seam welding and brazing layers of metal alloy materials. Including welding (welding wire), welding (welding rod), solder (brazing and soldering alloy) and so on. Welding solder is usually not lower than the melting temperature of the solidus of the base material, its chemical composition, mechanical, and thermal properties are relatively close to the base material, such as a variety of welding, flux-cored wire and so on.

Solder ball is widely used in modern microelectronics, IC manufacturing process is a function of notebook computers, mobile communication devices, computer motherboards, light emitting diodes, liquid crystal displays, PDA, digital photos and other products with the essential craft materials, particularly play a crucial role in the process of LSI miniature.