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Introduction
As lead free product, Sn-Cu alloy solder has replaced the lead solder and widely works for soldering electronic elements and fix the silicone products. This tin copper alloy is made up of 99.3% tin and 0.7% copper (Sn99.3Cu0.7) and has the melting point of approximately 227 degrees Celsius. Sn99.3Cu0.7 is available in both wave soldering and dip soldering, because it is eco-friendly and meets high demands for environmental protection.
Hazardous Chemical Elements in Sn-Cu Alloy Solder
1. Lead (Pb)
In each kind of homogeneous material, the amount of lead is less than 0.1% by weight.
2. Mercury (Hg)
The amount of mercury in each kind of homogeneous material is less than 0.1% by weight.
3. Cadmium (Cd)
In each homogeneous material, the amount of cadmium is less than 0.01% by weight.
	Typical Product
Sn99.3Cu0.7 Copper Tin Lead Free Solder Wire
Sn99.3Cu0.7 Copper Tin Lead Free Solder Wire
Parameters of Sn-Cu Alloy Solder
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					 Series  | 
				
					 Model  | 
				
					 Representative Composition  | 
				
					 Characteristics  | 
				
					 Applicable Process  | 
			
| 
					 Sn-Cu  | 
				
					 LC-01-01  | 
				
					 Sn-0.7Cu  | 
				
					 It features low melting point ,low using temperature, strong anti-oxidation property, good solder ability and thermal fatigue resistance. The surface of solder joints is bright and glazed, it is mainly used for manual soldering and wave soldering.  | 
				
					 Manual Soldering, Wave Soldering  | 
			
| 
					 LC-01-02  | 
				
					 Sn-1.5Cu  | 
				
					 It is featured with low melting point, high using temperature, high anti-oxidation. It is mainly used for the disposable soldering for the stripping of enamelled wires.  | 
				
					 Manual Soldering  | 
			|
| 
					 LC-01-03  | 
				
					 Sn-3.0Cu  | 
			
	





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