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Introduction
As lead free product, Sn-Cu alloy solder has replaced the lead solder and widely works for soldering electronic elements and fix the silicone products. This tin copper alloy is made up of 99.3% tin and 0.7% copper (Sn99.3Cu0.7) and has the melting point of approximately 227 degrees Celsius. Sn99.3Cu0.7 is available in both wave soldering and dip soldering, because it is eco-friendly and meets high demands for environmental protection.
Hazardous Chemical Elements in Sn-Cu Alloy Solder
1. Lead (Pb)
In each kind of homogeneous material, the amount of lead is less than 0.1% by weight.
2. Mercury (Hg)
The amount of mercury in each kind of homogeneous material is less than 0.1% by weight.
3. Cadmium (Cd)
In each homogeneous material, the amount of cadmium is less than 0.01% by weight.
Typical Product
Sn99.3Cu0.7 Copper Tin Lead Free Solder Wire
Sn99.3Cu0.7 Copper Tin Lead Free Solder Wire
Parameters of Sn-Cu Alloy Solder
Series |
Model |
Representative Composition |
Characteristics |
Applicable Process |
Sn-Cu |
LC-01-01 |
Sn-0.7Cu |
It features low melting point ,low using temperature, strong anti-oxidation property, good solder ability and thermal fatigue resistance. The surface of solder joints is bright and glazed, it is mainly used for manual soldering and wave soldering. |
Manual Soldering, Wave Soldering |
LC-01-02 |
Sn-1.5Cu |
It is featured with low melting point, high using temperature, high anti-oxidation. It is mainly used for the disposable soldering for the stripping of enamelled wires. |
Manual Soldering |
|
LC-01-03 |
Sn-3.0Cu |
Lantytk Solder Material
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